- Part Number
- 32-6553-18
- Manufacturer
- Aries Electronics
- Description
- CONN IC DIP SOCKET ZIF 36POS TIN
- Package
- -
- Number of Positions or Pins (Grid)
- 36 (2 x 18)
- Pitch - Mating
- 0.100" (2.54mm)
- Contact Finish - Mating
- Tin
- Contact Finish Thickness - Mating
- 200µin (5.08µm)
- Contact Material - Mating
- Beryllium Copper
- Mounting Type
- Through Hole
- Features
- Closed Frame
- Termination
- Solder
- Pitch - Post
- 0.100" (2.54mm)
- Contact Finish - Post
- Tin
- Contact Finish Thickness - Post
- 200µin (5.08µm)
- Contact Material - Post
- Beryllium Copper
- Housing Material
- Polyphenylene Sulfide (PPS), Glass Filled
- Operating Temperature
