- Part Number
- XR2D-4001-N
- Manufacturer
- Omron Electronics Inc-EMC Div
- Description
- CONN IC DIP SOCKET 40POS GOLD
- Package
- -
- Number of Positions or Pins (Grid)
- 40 (2 x 20)
- Pitch - Mating
- 0.100" (2.54mm)
- Contact Finish - Mating
- Gold
- Contact Finish Thickness - Mating
- 29.5µin (0.75µm)
- Contact Material - Mating
- Beryllium Copper
- Mounting Type
- Through Hole
- Features
- Carrier
- Termination
- Solder
- Pitch - Post
- 0.100" (2.54mm)
- Contact Finish - Post
- Gold
- Contact Finish Thickness - Post
- 29.5µin (0.75µm)
- Contact Material - Post
- Beryllium Copper
- Housing Material
- Polybutylene Terephthalate (PBT), Glass Filled
- Operating Temperature
