S25FL128SAGBHIA00

Infineon S25FL128SAGBHIA00

128 Mb (16 MB)/256 Mb (32 MB) FL-S Flash

SPI Multi-I/O, 3.0V

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Features
• CMOS 3.0 V core with versatile I/O
• SPI with multi-I/O
- SPI clock polarity and phase modes 0 and 3
- DDR option
- Extended addressing: 24- or 32-bit address options
- Serial command set and footprint compatible with S25FL-A, S25FL-K, and S25FL-P SPI families
- Multi I/O command set and footprint compatible with S25FL-P SPI family
• READ commands
- Normal, Fast, Dual, Quad, Fast DDR, Dual DDR, Quad DDR
- AutoBoot - Power up or reset and execute a Normal or Quad read command automatically at a preselected
address
- Common flash interface (CFI) data for configuration information
• Programming (1.5 MBps)
- 256- or 512-byte page programming buffer options
- Quad-input page programming (QPP) for slow clock systems
- Automatic ECC-internal hardware error correction code generation with single bit error correction
• Erase (0.5 to 0.65 MBps)
- Hybrid sector size option - Physical set of thirty two 4-KB sectors at top or bottom of address space with all
remaining sectors of 64 KB, for compatibility with prior generation S25FL devices.
- Uniform sector option - always erase 256-KB blocks for software compatibility with higher density and future
devices.
• Cycling endurance
- 100,000 program-erase cycles, minimum
• Data retention
- 20 year data retention, minimum
• Security features
- OTP array of 1024 bytes
- Block protection
• Status Register bits to control protection against program or erase of a contiguous range of sectors.
• Hardware and software control options
- Advanced sector protection (ASP)
• Individual sector protection controlled by boot code or password
• 65-nm MIRRORBIT™ technology with Eclipse architecture
• Core supply voltage: 2.7 V to 3.6 V
• I/O supply voltage: 1.65 V to 3.6 V
- SO16 and FBGA packages

• Temperature range/grade:
- Industrial (40°C to +85°C)
- Industrial Plus (40°C to +105°C)
- Automotive AEC-Q100 grade 3 (40°C to +85°C)
- Automotive AEC-Q100 grade 2 (40°C to +105°C)
- Automotive AEC-Q100 grade 1 (40°C to +125°C)
• Packages (all Pb-free)
- 16-lead SOIC (300 mil)
- WSON 6  8 mm
- BGA-24 6  8 mm
• 5  5 ball (FAB024) and 4  6 ball (FAC024) footprint options
• Known good die (KGD) and known tested die